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Kaars stand-light metalen constructie met planken in de vorm van manden. Wielen met remmen zorgen voor mobiliteit en eenvoudige herpositionering van de standaard op het terrein van de winkel. Afbeeldingen gemaakt van kunststof en bedrukt met klantlogo.
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Sausstandaard gemaakt van metaal. Achterkant en zijkanten van pvc met afbeeldingen. Met vier planken kunt u een volledig assortiment instellen. Het aangename ontwerp moedigt u aan om naar het product te reiken.
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Standaard voor houten panelen van metaal. zorgt voor een gemakkelijke belichting van de panelen. De stand voor sublog panelen stelt u in staat om de beschikbare ruimte en exposities van vele vloervarianten te optimaliseren.
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With this article and some others that will follow later we would like to share available knowledge in the PCB design and manufacturing field.
Following some articles related to HDI PCBs we would like to describe the three related more common build-up structures.
HDI PCB types
The design designation system of this standard recognizes industry approved design types used in the manufacture of HDI printed boards. The designations determine the HDI design type by defining the number and location of HDI layers that may or may not be combined with a substrate.
Type I, Standard build-up for HDI
This construction describes an HDI in which there are both blind vias and through vias used for interconnection. Type I constructions describe the fabrication of a single blind via layer on either one or both sides of an PCB substrate core.
The PCB substrate is typically manufactured using conventional PCB techniques and laser via hole technology. The substrate can have as few as one circuit layer or may be as complex as any number of inner layers.
Type II, Sequential build-up 1+N+1
Tipe II is characterized by buried vias in the core and may have through vias through the outer layers. Type II constructions describe an HDI board in which there are plated microvias, plated buried vias and may have PTHs used for surface-to-surface interconnection.
Microvias on layer 1 and layer n grant the connection to conductors on layer 2 and layer n-1, making the connection with the core. Type II constructions can also have PTH to connect layer 1 directly to layer n.
Struttura Tipo III, build-up sequenziale X+N+X
Type III constructions describe an HDI in which there are plated microvias, paste/resin filled holes and through vias used for interconnection. Type III constructions are distinguished by having at least two microvia layers on at least one side of a substrate core. The substrate core is usually manufactured using conventional PCB techniques, may be rigid or flexible, and have as few as one or as many as any number of layers with buried vias.
Where space is minimal and if expressly requested, stacked vias - stacked blind holes - must be used - while where conditions allow it, staggered vias - non-overlapping blind holes on several levels - can be used. Staggered vias are less critical, so preferable, for manufacturing than stacked vias.
For more details, call us +39 059 269711 or send an e-mail sales@cistelaier.com
Following some articles related to HDI PCBs we would like to describe the three related more common build-up structures.
HDI PCB types
The design designation system of this standard recognizes industry approved design types used in the manufacture of HDI printed boards. The designations determine the HDI design type by defining the number and location of HDI layers that may or may not be combined with a substrate.
Type I, Standard build-up for HDI
This construction describes an HDI in which there are both blind vias and through vias used for interconnection. Type I constructions describe the fabrication of a single blind via layer on either one or both sides of an PCB substrate core.
The PCB substrate is typically manufactured using conventional PCB techniques and laser via hole technology. The substrate can have as few as one circuit layer or may be as complex as any number of inner layers.
Type II, Sequential build-up 1+N+1
Tipe II is characterized by buried vias in the core and may have through vias through the outer layers. Type II constructions describe an HDI board in which there are plated microvias, plated buried vias and may have PTHs used for surface-to-surface interconnection.
Microvias on layer 1 and layer n grant the connection to conductors on layer 2 and layer n-1, making the connection with the core. Type II constructions can also have PTH to connect layer 1 directly to layer n.
Struttura Tipo III, build-up sequenziale X+N+X
Type III constructions describe an HDI in which there are plated microvias, paste/resin filled holes and through vias used for interconnection. Type III constructions are distinguished by having at least two microvia layers on at least one side of a substrate core. The substrate core is usually manufactured using conventional PCB techniques, may be rigid or flexible, and have as few as one or as many as any number of layers with buried vias.
Where space is minimal and if expressly requested, stacked vias - stacked blind holes - must be used - while where conditions allow it, staggered vias - non-overlapping blind holes on several levels - can be used. Staggered vias are less critical, so preferable, for manufacturing than stacked vias.
For more details, call us +39 059 269711 or send an e-mail sales@cistelaier.com
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In PCB market,
HDI technology required the adoption of
new technical skills, new machineries and the implementation of the related production processes including that of f
illing the through holes and laser holes, necessary for the realization of" filled and capped vias”, technique also known as "plating over filled vias” well described by the IPC 4761 standard as Type VII filling.
The capped vias technology with hole filling with resin aims to increase the density of the interconnections in printed circuit boards by using the space occupied by through holes as SMD assembly points. This technique consists in filling the holes after plating them, with copper thicknesses on the walls, normally >25µm, and, in any case, defined with the customer.
The resins adopted for "filled and capped vias” have specific insulation properties and dimensional variation with temperatures, they are treated with heat for the relative polymerization and consequent hardening, and, subsequently, are first planarized and then covered with a layer of copper with a thickness of at least 15µm.
This technique can be applied for the realization of different types of printed circuits and with multiple application variants which for this reason are in strong expansion:
- pads used for µBGA, "ball on via technology" and SMD assembly: "Via in Pad Assembly Technology"
- pads used as test points, "Via in Pad Test Technology”
- heat dissipation pads under the cases of the components for "heat management”
- SBU - sequential build up" construction with laser stacked holes on buried holes treated as capped vias
The fundamental operations for filling the holes with resin are carried out in two distinct phases: in the first, the holes are filled with variable pressure and vacuum to allow perfect filling of the holes without the risk of gaps in the resin, while, in the second phase, a surface cleaning of the panel is performed to eliminate the excess resin, facilitating its subsequent planarization.
Whatever the final technology chosen, after complete polymerization, the resin is removed by a mechanical brushing action, called planarization, which can be performed with specific machines that work with cup brushes or with horizontal brushing machines.
The target is to remove the excess resin and create a uniform surface: this operation is a prerequisite for the subsequent over-plating of the filled vias with copper to allow ideal soldering of electronic components. (inserisci disegno).
The knowledge of "capped vias" technology is fundamental today to create compliant pcbs to market and regulations standards required, especially relating to the growing HDI technology demand.
The capped vias technology with hole filling with resin aims to increase the density of the interconnections in printed circuit boards by using the space occupied by through holes as SMD assembly points. This technique consists in filling the holes after plating them, with copper thicknesses on the walls, normally >25µm, and, in any case, defined with the customer.
The resins adopted for "filled and capped vias” have specific insulation properties and dimensional variation with temperatures, they are treated with heat for the relative polymerization and consequent hardening, and, subsequently, are first planarized and then covered with a layer of copper with a thickness of at least 15µm.
This technique can be applied for the realization of different types of printed circuits and with multiple application variants which for this reason are in strong expansion:
- pads used for µBGA, "ball on via technology" and SMD assembly: "Via in Pad Assembly Technology"
- pads used as test points, "Via in Pad Test Technology”
- heat dissipation pads under the cases of the components for "heat management”
- SBU - sequential build up" construction with laser stacked holes on buried holes treated as capped vias
The fundamental operations for filling the holes with resin are carried out in two distinct phases: in the first, the holes are filled with variable pressure and vacuum to allow perfect filling of the holes without the risk of gaps in the resin, while, in the second phase, a surface cleaning of the panel is performed to eliminate the excess resin, facilitating its subsequent planarization.
Whatever the final technology chosen, after complete polymerization, the resin is removed by a mechanical brushing action, called planarization, which can be performed with specific machines that work with cup brushes or with horizontal brushing machines.
The target is to remove the excess resin and create a uniform surface: this operation is a prerequisite for the subsequent over-plating of the filled vias with copper to allow ideal soldering of electronic components. (inserisci disegno).
The knowledge of "capped vias" technology is fundamental today to create compliant pcbs to market and regulations standards required, especially relating to the growing HDI technology demand.
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Staan voor tuingereedschap, noodzakelijk in elke tuinwinkel, industrieel. De shovelstand zal de exposities in de winkel, in het gedeelte Huis en Tuin perfect aanvullen. Stabiele constructie gemaakt van gepoedercoat metaal.
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Metalen boekenkast voor drankjes met 4 verdiepingen voor het ophangen van flessen. hangers die in het Coca-cola drankenrek worden geplaatst, maken het gemakkelijk om flessen te verwijderen. Met deze oplossing u een groter deel van het product opslaan en het nog toegankelijker maken voor klanten op het verkooppunt.
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De Torun wodkastandaard verwijst naar een fles uit de jaren 1920, is ontworpen en vervaardigd om de zichtbaarheid van de stijlvolle fles te vergroten en de unieke blootstelling op het verkooppunt te benadrukken. Stevige schappen maken het mogelijk om 70 flessen op te slaan en te verlichten met aantrekkelijke productpresentaties. Op de originele manier werd het merk gepresenteerd, wat de erkenning op de markt verhoogde.
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Peperset van twee salontafels, metalen gepoedercoate constructie, tafelblad met meubelplaat. Salontafels zijn ingericht in een minimalistische stijl, ideaal voor moderne interieurs. Peper salontafel set neemt niet veel ruimte in beslag, u een kleinere tafel onder de tweede schuiven of instellen met twee afzonderlijke
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feb 25 2021
Andere
HDI technology for high-performance printed circuit boards
Datum 25 februari 2021 16:08
The global electronics market has been pushing for years towards increasing
miniaturization.
This trend is imposed by the market demand for increasingly portable devices, therefore of low weight, and capable of integrating many functions: the real challenge is to reduce the size of the devices, miniaturizing them, and, at the same time, to increase their performance.
The target can be reached basically by working on the structure of the printed circuit board by increasing the density of the components on the surface and the number of connections between the layers that make it up: this need has therefore led to the birth and diffusion of " HDI - High Density Interconnection" structures.
All circuits with pitches’ density per surface with values greater than 20 pitches/cm² greater than traditional printed circuit boards (PCBs) are defined as high interconnection density PCBs (HDI). This therefore results in smaller size for design parameters such as tracks less than 100 ?m/4mils wide, laser holes with a diameter less than 150 ?m/6mils and pitches with a diameter less than 400 ?m/16mils.
keep reading
This trend is imposed by the market demand for increasingly portable devices, therefore of low weight, and capable of integrating many functions: the real challenge is to reduce the size of the devices, miniaturizing them, and, at the same time, to increase their performance.
The target can be reached basically by working on the structure of the printed circuit board by increasing the density of the components on the surface and the number of connections between the layers that make it up: this need has therefore led to the birth and diffusion of " HDI - High Density Interconnection" structures.
All circuits with pitches’ density per surface with values greater than 20 pitches/cm² greater than traditional printed circuit boards (PCBs) are defined as high interconnection density PCBs (HDI). This therefore results in smaller size for design parameters such as tracks less than 100 ?m/4mils wide, laser holes with a diameter less than 150 ?m/6mils and pitches with a diameter less than 400 ?m/16mils.
keep reading
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Display op Coca Cole die de blootstellingen van individuele producten combineert, evenals de mogelijkheid om meer goederen op te slaan. Ruwe hout- en metaalelementen benadrukken op een originele manier de blootgestelde producten.
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Weergave ontworpen voor belichting van tegels. Het maakt een uitgebreide presentatie van de installatie van het gehele daksysteem mogelijk dankzij het gebruik van: instructieborden, folders, videopresentaties en een dwarsdoorsnedemodel van de dakconstructie. Het roterende ontwerp van de standaard zorgt voor een gemakkelijke weergave van de belichting, en de achtergrondverlichting van het product en logo trekt de aandacht van de potentiële klant.
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Gras metalen bloemperk op de nózki is minimalistisch, solide en tijdloos. Het geheel gemaakt van metaal, gepoedercoat met afmetingen van 500x250x750 Ziet er indrukwekkend uit op het balkon, terras en veranda. Gras metalen bloemperk zal geweldig werken als een aanvulling op loft-stijl interieurs, Scandinavische
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feb 9 2021
Andere
IMPACT OF MOISTURE ON SOLDERING QUALITY OF ELECTRONIC COMPONENTS ON PCBs
Datum 9 februari 2021 7:52
In the previous technical article we illustrated
some defects generated on PCBs due to the presence of humidity.
In particular, we have highlighted that the moisture absorbed by the base material can generate delamination during the assembly of PCBs.
With this second article, relating to the risks generated on PCBs by the presence of humidity, we deepen the subject and deal, in particular, with the impact of humidity on the Tg of the base materials and the consequences on the quality of PCBs and PCBAs.
The Tg of a polymeric material (laminates and pre-impregnates are partially made of resin) represents the temperature value at which the glass transition begins which we could define as the temperature at which the resin changes its mechanical characteristics starting to soften: for this reason it is important to choose the base material in relation to the expected conditions of use of each PCB.
To read all the article, click here
In particular, we have highlighted that the moisture absorbed by the base material can generate delamination during the assembly of PCBs.
With this second article, relating to the risks generated on PCBs by the presence of humidity, we deepen the subject and deal, in particular, with the impact of humidity on the Tg of the base materials and the consequences on the quality of PCBs and PCBAs.
The Tg of a polymeric material (laminates and pre-impregnates are partially made of resin) represents the temperature value at which the glass transition begins which we could define as the temperature at which the resin changes its mechanical characteristics starting to soften: for this reason it is important to choose the base material in relation to the expected conditions of use of each PCB.
To read all the article, click here
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Ovale spiegel in een metalen frame benadrukken de stijl van het interieur. Het metalen frame van de spiegel is een karakteristiek en aandachtstrekkend element. Ovale spiegel in metalen frame zal werken in elke regeling. afmetingen:100 cmx70 cm
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Een strakke wandspiegel. Het model heeft een roestvrij stalen frame, ideaal voor badkamers. Ze benadrukten perfect de arrangementen van het interieur in scandinavische, moderne stijl. De vorm van de spiegel stelt u in staat om het product comfortabel te gebruiken. Spiegeldiameter 610mm
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In ons aanbod vindt u niet alleen eindproducten, maar ook diensten. Een van hen is lasersnijden van metaal. Met behulp van een laserstraal snijden we alle vormen uit die passen binnen de technische mogelijkheden van onze machines. U ontvangt in eerste instantie een tussenproduct of eindproduct van ons – afhankelijk van het doel van het product. Lasersnijden wordt gebruikt voor de verwerking van constructiestaal, roestvrij staal en aluminium.
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Peppper brandhout staan - eenvoudige constructie, poeder bekleed. De open haard staan voor de boom u orde te brengen in de kamer waar de open haard is gevestigd. Geplaatst glade in een standaard voor brandhout benadrukken het moderne karakter van het interieur. De brandhouten standaard is een combinatie van etethische en nut op maat van elke woonkamer met open haard.
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Ongeacht het seizoen van gloeilampen die we elke dag nodig hebben Daarom is investeren in een multimediadisplay voor de presentatie van gloeilampen altijd een goed idee Het gebruik van interactieve elementen trekt zeker potentiële klanten aan, en de verlichte elementen en de originele vorm zullen iedereen zonder uitzondering interesseren.
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