Multilayer SBU with 5+N+5 with Cu filled vias of CISTELAIER S.P.A.
Product
Technology: Multilayer SBU with 5+N+5 with Cu filled vias
Material: Polyamide + CopperInvarCopper
Finishing: Enig + cavity with Electrolityc Nickel
Description of the Product
Technology: Multilayer SBU with 5+N+5 with Cu filled vias
Material: Polyamide + CopperInvarCopper
Finishing: Enig + cavity with Electrolityc Nickel